The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine-Reference-Cited by-同舟云学术

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The composition and microstructure of electrodeposited solder on electroless nickel in the presence of gelatine

Published:1995-04 Issue:7 Volume:30 Page:1879-1883
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:JOURNAL OF MATERIALS SCIENCE

Author:

Lin Kwang-Lung,Chang Jieh-Ting

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF00351625.pdf

Reference19 articles.

1. A. H. Durose and D. M. Hutchison, Plating (May) (1953) 470.

2. A. K. Graham and H. L. Pinkerton, ibid. (April) (1965) 309.

3. B. F. Rothschild and D. Sanders, ibid. (December) (1969) 1363.

4. J. P. Langon, Plating Surf. Finish. (January) (1983) 21.

5. J. B. Mohler, Iron Age (February) (1952) 139.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The effect of peptone on the structure of electrodeposited Sn-Fe binary alloys;Hyperfine Interactions;2016-02-18

2. Synergistic effects of organic additives on the discharge, nucleation and growth mechanisms of tin at polycrystalline copper electrodes;Journal of Electroanalytical Chemistry;2002-11

3. Approaching a uniform bump height of the electroplated solder bumps on a silicon wafer;IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B;1996

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