Abstract
AbstractThis study focused on determining the optimum conditions for the maximum recovery of base and precious metals from printed circuit boards of end-of-life desktop computer motherboards using Taguchi-based grey relation analysis. In the first stage of the two-stage study, optimum conditions were investigated for the dissolution of base metals (copper and zinc) in waste printed circuit boards under high-pressure leaching. The dissolution of base metals was performed based on the L25 orthogonal array designed by Taguchi method. In the second step, designed according to Taguchi L9 orthogonal array to recover gold and silver from the solid remaining from the pressure-leaching process. Optimum combinations of parameters in both stages were determined using the multi-criteria optimization technique grey relationship analysis. In the experiments carried out in the determined optimum combinations, 99.62% of copper, 98.76% of zinc, 99.15 of silver and 85.82% of gold in waste printed circuit boards were recovered.
Graphical Abstract
Publisher
Springer Science and Business Media LLC
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