Author:
Worgull M.,Heckele M.,Schomburg W. K.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
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5. Worgull M, Heckele M, Schomburg WK (2003) Analysis of the micro hot embossing process. Forschungszentrum Karlsruhe, FZKA-Bericht 6922
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