Author:
Zhao Cheng,Song Jing,Han Lei,Huang Qing-An
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. Chen MJ, Pham AVH (2006) Design and development of a package using LCP for RF/microwave MEMS switches. IEEE Trans Microw Theory Tech 54:4009–4015
2. Chen Z, Huang W, Cai X, Xu B, Luo L, Li X (2004) Packaging effects on the performances of MEMS for high-G accelerometer: frequency-domain and time-domain analyses. In: Proceedings of the high density packaging (HDP’04), pp 282–289
3. Chou T-L, Chu C-H, Lin C-T, Chiang K-N (2009) Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor. Sens Actuators A 152:29–38
4. Fischer S, Wilde J (2008) Modeling package-induced effects on molded Hall sensors. IEEE Trans Adv Packag 31:594–602
5. Krondorfer RH, Kim YK (2007) Packaging effect on MEMS pressure sensor performance. IEEE Trans Compon Packag Technol 30:285–293
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献