Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. Abdolvand R, Amini BV, Ayazi F (2007) Sub-micro-gravity in-plane accelerometers with reduced capacitive gaps and extra seismic mass. J Microelectromech Syst 16:1036–1043
2. Bagdahn J, Petzold M, Reiche M, Gutjahr K (1998) Characterisation of directly bonded silicon wafers by means of the double cantilever crack opening method. In: Proceedings of the fourth international symposium on semiconductor wafer bonding, vol 97–36. pp 291–298
3. Benini L, De Micheli G (2002) Networks on chips: a new SoC paradigm. Computer 35(1):70–78
4. Grahmann J et al (2015) Large MOEMS diffraction grating results providing an EC-QCL wavelength scan of 20%. In: Proceedings of SPIE 9375, MOEMS and miniaturized systems XIV, 93750W. doi: 10.1117/12.2079640
5. Kim JH et al (2005) A high performance complementary bipolar process using PBSOI technique. In: Advanced semiconductor manufacturing conference and workshop, 2005 IEEE/SEMI. pp 200–204