Author:
Müller Tobias,Piotter Volker,Plewa Klaus,Guttmann Markus,Ritzhaupt-Kleissl Hans-Joachim,Hausselt Juergen
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. German RM (1990) Powder injection molding. MPIF, Princeton
2. Guttmann M, Schulz J, Saile V (2005) Lithographic fabrication of mold inserts. In: Baltes H, Brand O, Fedder GK, Hierold C, Korvink JG, Tabata O (eds) Advanced micro and nanosystems, vol 3. Microengineering of metals and ceramics. Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, pp 187–219
3. Heldele R, Schulz M, Kauzlaric D, Korvink G, Haußelt J (2006) Micro powder injection molding: process characterization and modelling. Microsyst Technol Micro Nanosyst Inform Storage Process Syst 12:941–946. http://www.sfb499.de (Accessed 23 July 2009)
4. Merz L (2004) Micro powder injection molding with advanced materials. PIM 2004 International Conference, Orlando/Florida
5. Schanz G, Bade K (2005) Microelectroforming of metals. In: Baltes H, Brand O, Fedder GK, Hierold C, Korvink JG, Tabata O (eds) Advanced micro and nanosystems, vol 4. Microengineering of metals and ceramics. Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, pp 395–420
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