Novel heat dissipation design for light emitting diode applications-Reference-Cited by-同舟云学术

Novel heat dissipation design for light emitting diode applications

Published:2010-01-20 Issue:4 Volume:16 Page:519-526
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Chang Chao-Chi,Huang De-Shau,Lin Ming-Tzer,Horng Ray-Hua,Lai Chi-Ming

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-010-1024-x.pdf

Reference6 articles.

1. Gaugler R (1966) Heat transfer devices. US patent 2350348 Published

2. Haque S, Steigerwald D, Rudaz S, Steward B (2003) Packaging challenges of high power LEDs for solid state lighting. Proceeding from international microelectronics and packaging society

3. Kim L, Choi JH, Jang SH, Shin MW (2007) Thermal analysis of LED array system with heat pipe. Thermochim Acta 455:21–25

4. Lee CR (2006) Enhancing heat pipe performance by central heating. Dissertation. National Cheng Kung University

5. Murase T, Yoshida K, Fujikake J, Koizumi T, Ishida N (1982) Heat pipe heat sink heat kicker for cooling of semi-conductors. Furukawa Rev 2:24–33

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