Retraction Note: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages
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Published:2023-04-05
Issue:5
Volume:29
Page:793-793
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ISSN:0946-7076
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Container-title:Microsystem Technologies
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language:en
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Short-container-title:Microsyst Technol
Author:
Surendar A.,Siswanto Waluyo Adi,Alijani Maryam,Alhaifi K.,Salmani Mohammad
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials