Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. Saotome Y, Yokote S, Okamoto T et al (2003) Design and in-situ mechanical testing system for probe card/UV-LIGA-Ni microspring. In: Proceedings IEEE sixteenth annual international conference on micro electro mechanical systems, pp 670–673
2. Vujanic A, Adamovic N, Jakovljevic M et al (2000) Silicon microstructure for precise measurements of mechanicalmoments. In: 22nd international conference on microelectronics proceedings, pp 565–568
3. Di Chen, Lei Shi, Jun Zhu et al (2003) Simulation, fabrication and characterization of planar microsprings. Microfabr Technol 7(8):57–60
4. Seto MW, Robbie K, Brett MJ et al (1999) Mechanical properties of microspring thin films fabricated by glancing angle deposition (GLAD). In: Engineering solutions for the next millennium. 1999 IEEE Canadian conference on electrical and computer engineering, pp 1616–1620
5. Brenner W, Haddad GH, Rennhofer H (2000) New types of silicon torsion microspring and their characterization. In: Proceedings of SPIE-design, test, integration, and packaging of MEMS/MOEMS, pp 462–470
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