Author:
Saha B.,Dirckx M.,Hardt D. E.,Tor S. B.,Liu E.,Chun J. H.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. Barletta A, Gisario A, Tagliaferri V (2006) Electrostatic spray deposition (ESD) of polymeric powders on thermoplastic (PA66) substrate. Surf Coat Technol 201:296–308
2. Becker H, Heim U, Ieee I (1999) Silicon as tool material for polymer hot embossing, in Mems ‘99,In: twelfth ieee international conference on micro electro mechanical systems, technical digest. pp. 228–231
3. Benayoun S, Fouilland-Paille L, Hantzpergue JJ (1999) Microscratch test studies of thin silica films on stainless steel substrates. Thin Solid Films 352:156–166
4. Benjamin P, Weaver C (1960) Measurement of adhesion of thin films. Proc R Soc Lond Ser A 254:163–176
5. Dirckx M (2010) Demolding of hot embossed polymer microstructures, in Mechanical Engineering. Massachusetts institute of technology, Cambridge, MA
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献