Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors-Reference-Cited by-同舟云学术

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Temperature characterization of flip-chip packaged piezoresistive barometric pressure sensors

Published:2014-01-10 Issue:4-5 Volume:20 Page:861-867
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Waber T.,Pahl W.,Schmidt M.,Feiertag G.,Stufler S.,Dudek R.,Leidl A.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-013-2064-9.pdf

Reference9 articles.

1. Cabruja E, Collado A, Plaza JA, Esteve J (2005) Piezoresistive accelerometers for MCM-package—part II: the packaging. J Microelectromech Syst 14(4):806–811

2. Campabadal F, Carreras JL, Cabruja E (2006) Flip-chip packaging of piezoresistive pressure sensors. Sens Actuators A 132:415–419

3. Deier E, Wilde J (2003) Thermomechanisches Verhalten der Montageklebung eines mikromechanischen Drucksensors. 14. Symposium Verbundwerkstoffe und Werkstoffverbunde, DGM-Tagung, Wien, pp 649–654

4. Feiertag G, Winter M, Leidl A (2009) Packaging of MEMS microphones. In: Proceedings of the SPIE 7362

5. Lammel G, Gutmann J, Marti L, Dobler M (2009) Indoor navigation with MEMS sensors. Proceedings of the eurosensors XXIII, pp 532–535

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2. Advances in high-performance MEMS pressure sensors: design, fabrication, and packaging;Microsystems & Nanoengineering;2023-12-19

3. Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor;Sensors;2020-03-19

4. Numerical Optimization of Thermally Induced Hysteresis Effects in the Packaging of MEMS Pressure Sensors;IEEE Sensors Journal;2019-05-15

5. A Micromachined Piezoresistive Pressure Sensor with a Shield Layer;Sensors;2016-08-13

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