1. Barker NS, Rebeiz GM (1999) Optimization of distributed MEMS phase shifters, 1999. IEEE MTTS Int Microw Symp 1:13–19
2. Cai J, Wang Q, Li XG (2005) Microstructure of AuSn Wafer Bonding for RF-MEMS packaging. IEEE 6th ICEPT, pp 387–392
3. Forehand DI, Goldsmith CL (2005) Wafer level micropackaging for RF MEMS Switches, Proceeding of IPACK, pp 256–261
4. He XJ, Wu Q, Zhu HC, Lee JC (2007) Wafer level micropackaging based on Ka band distributed MEMS phase shifters. Chinese Chin J Sci Instrum 28(1):23–28
5. Heck J, Greathouse S (2003) Towards wafer-scale MEMS packaging: a review of recent advances. International conference on SMTA, pp 631–636