A new hybrid fabrication process for a high sensitivity MEMS microphone-Reference-Cited by-同舟云学术

A new hybrid fabrication process for a high sensitivity MEMS microphone

Published:2013-06-13 Issue:9-10 Volume:19 Page:1425-1431
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Chao Paul C.-P.,Tsai Chun-Yin,Chiu Chi-Wei,Tsai Che-Hung,Tu Tse-Yi

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-013-1829-5.pdf

Reference21 articles.

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2. Bergqvist J, Rudolf F (1990) A new condenser microphone in silicon. Sens Actuators 21:123–125

3. Chan C-K, Lai W-C, Wu M, Wang M-Y, Fang W (2011) Design and implementation of a capacitive-type microphone with rigid diaphragm and flexible spring using the two poly silicon micromachining processes. IEEE Sens J 11:2365–2371

4. Chao PC-P, Chiu C-W, Tsai C-Y (2006) A novel method to predict the pull-in voltage in a closed form for micro-plate actuated by a distributed electrostatic force. J Micromech Microeng 16:986–998

5. Chao PC-P, Chiu C-W, Liu T-H (2008) DC dynamic pull-in predictions for a generalized clamped–clamped micro-beam based on a continuous model and bifurcation analysis. J Micromech Microeng 18:14

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