Laser micro-welding of aluminum and copper with and without tin foil alloy

Author:

Hailat Mohammad M.,Mian Ahsan,Chaudhury Zariff A.,Newaz Golam,Patwa Rahul,Herfurth Hans J.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference19 articles.

1. Davis JR (ed) (1998) Metals handbook, 2nd edn. ASM International, Materials Park, OH. ISBN 0-87170-654-7

2. Chadwick R (1938) The influence of surface alloying on the strength of soft soldered joints. J Inst Met 62:277

3. Chatter S, Abinandanon TA, Chattopadhyay K (2006) Microstructure development during dissimilar welding: case of laser welding of Ti with Ni involving intermetallic phase formation. J Mater Sci 41:643

4. Ege ES, Inal OT (2000) Stability of Interfaces in explosively-welded aluminum-titanium laminates. J Mater Sci 19:1533–1535

5. Esser G, Mys I, Schmdit MH (2004) Laser micro welding of copper and aluminum using filler materials. Proc SPIE 5662:337–342

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