Study of mechanical response in micro-indentation of laminated ceramic green substrates
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://link.springer.com/content/pdf/10.1007/s00542-008-0735-8.pdf
Reference18 articles.
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2. Beake BD, Smith JF (2002) High-temperature nanoindentation testing of fused silica and other materials. Philos Mag A 82:2179–2186
3. Becker H, Heim U (2000) Hot embossing as a method for the fabrication of polymer high aspect ratio structures. Sensors Actuators A 83:130–135. doi: 10.1016/S0924-4247(00)00296-X
4. Golonka LJ (2005) New application of LTCC technology. In: IEEE Proceeding of 28th international seminar on electronics technology. Austria, pp 162–166
5. Gongora-Rubio MR, Espinoza-Vallejos L, Sola-Laguna L, Santiago-Aviles JJ (2001) Overview of low temperature co-fired ceramics tape technology for meso-system technology. Sens Actuators A 89:222–241. doi: 10.1016/S0924-4247(00)00554-9
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