The effects on residual stress in multilayer NTC thermistors during soldering process and bending test (I. soldering process)
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s00542-020-04855-0.pdf
Reference20 articles.
1. Aleksić OS (2007) Modeling and simulation of NTC thick film thermistor geometries. Microelectron Int 24:27–34
2. Aleksić OS (2017) Recent advances in NTC thick film thermistor properties and applications. Electron Energ 30:267–284. https://doi.org/10.2298/fuee1703267a
3. Ali R, Sebastiani M (2015) Influence of Ti-TiN multilayer PVD-coatings design on residual stresses and adhesion. Mater Des 75:47–56. https://doi.org/10.1016/j.matdes.2015.03.007
4. Altenburg H (2001) Semiconductor ceramics for NTC thermistors: the reliability aspects. J Eur Ceram Soc 21:1787–1791. https://doi.org/10.1016/s0955-2219(01)00116-9
5. Buchanan RC (2019) Ceramic materials for electronics, third edition, revised and expanded. CRC Press. ISBN 9780367394134
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