Author:
Dowhań Łukasz,Wymysłowski Artur,Dudek Rainer
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Dowhań Ł, Wymysłowski A, Dudek R, Auersperg J (2006a) Parametric approach to numerical design for optimization of stacked packages, In: ESTC Conference, Dresden, Germany
2. Dowhań Ł, Wymysłowski A, Dudek R, Auersperg J (2006b) Numerical approach to optimization of stacked packages. In: IMAPS Conference, Kraków, Poland
3. Dowhań Ł, Wymysłowski A, Dudek R (2007) Multi-objective parametric approach to numerical optimization of stacked packages. In: EuroSime Conference, London, UK
4. Saaty TL (1999) The seven pillars of the Analytic Hierarchy Process. 322 Mervis Hall, Pittsburg, USA
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