Metamodel assisted evolution strategies for global optimization of solder joints reliability in embedded mechatronic devices

Author:

Hamdani Hamid,Radi Bouchaïb,El Hami Abdelkhalak

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference39 articles.

1. Anand L (1982) Constitutive equations for the rate-dependent deformation of metals at elevated temperatures. J Eng Mater Technol Trans ASME 104(1):12–17

2. Aoues Y, Makhloufi A, Pougnet P, El Hami A (2012) Probabilistic assessment of thermal fatigue of solder joints in mechatronic packaging. In: Proceedings of the 1st international symposium on uncertainty quantification and stochastic modeling, Maresias, SP

3. Bäck T, Foussette C, Krause P (2013) Contemporary evolution strategies. Springer, New York

4. Branke J, Schmidt C (2005) Faster convergence by means of fitness estimation. Soft computing-A fusion of foundations, methodologies and applications 9(1):13–20

5. El Hami A, Pougnet P (2015) Embedded mechatronic systems, vol 2. Elsevier, Amsterdam

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