Author:
Costello S.,Strusevich N.,Flynn D.,Kay R. W.,Patel M. K.,Bailey C.,Price D.,Bennet M.,Jones A. C.,Desmulliez M. P. Y.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. Costello S, Strusevich N, Patel MK, Bailey C, Flynn D, Kay RW, Price D, Bennet M, Jones AC, Habeshaw R, Demore C, Cochran S, Desmulliez MPY (2011) Characterisation of ion transportation during electroplating of high aspect ratio micro-vias using megasonic agitation. Proceedings of the European Microelectronics Packaging Conference, Brighton
2. Dudderar TD, Meynart R, Simpkins PG (1988) Full field laser metrology for fluid velocity measurements. Opt Lasers Eng 9:163–199
3. Wolf M, Dretschkow T, Wunderle B, Jürgensen N, Engelmann G, Ehrmann C, Uhlig A, Michel B, Reichl H (2008) High aspect ratio TSV copper filling with different seed layers. In: IEEE 58th electronics components technology conference, vol. 2, pp 563–570
4. Zhang Y, Barber RW, Emerson D (2005) Particle Separation in microfluidic devices—SPLITT fractionation and microfluidics. In: Current analytical chemistry, vol. 1, pp 345–354
5. Zhang Y, Richardson T, Chung S, Wang C, Kim B, Rietmann C (2007) Fast copper plating process for TSV fill. In: Microsystems, packaging, assembly and circuits technology, pp 219–222
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