Low power consumption physics package for chip-scale atomic clock through gold-tin eutectic bonding
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s00542-022-05283-y.pdf
Reference42 articles.
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3. Balabas MV, Budker D, Kitching J, Schwindt PD, Stalnaker JE (2006) Magnetometry with millimeter-cale antirelaxation-coated alkali-metal vapor cells. J Opt Soc Am B 23(6):1001–1006
4. Bang YS, Kim JM, Kim YS, Kim JM, Kim YK (2007) Fabrication and characterization of RF MEMS packaging based on LTCC lid substrate and gold-tin eutectic bonding. In: 14th International Solid-State Sensors, Actuators and Microsystems Conference, IEEE, pp. 2115–2118
5. Barnes BT, Forsythe WE, Adams EQ (1947) The total emissivity of various materials at 100–500 °C. J Opt Soc Am 37(10):804–807
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