Effect of process parameters on filling behavior of PMMA in hot embossing-Reference-Cited by-同舟云学术

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Effect of process parameters on filling behavior of PMMA in hot embossing

Published:2024-04-01 Issue:7 Volume:30 Page:845-858
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Li Jianzhi,Liu Jiashun,Gong Feng,Yang Gao^ORCID

Funder

National Natural Science Foundation of China

Basic and Applied Basic Research Foundation of Guangdong Province

Shenzhen Science and Technology Innovation Program

Human Resource Office of Shenzhen University

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s00542-024-05624-z.pdf

Reference25 articles.

1. Deshmukh SS, Goswami A (2021) Recent developments in hot embossing–a review. Mater Manuf Process 36(5):501–543. https://doi.org/10.1080/10426914.2020.1832691

2. Goral VN, Hsieh YC, Petzold ON et al (2010) Hot embossing of plastic microfluidic devices using poly (dimethylsiloxane) molds. J Micromech Microeng 21(1):017002. https://doi.org/10.1088/0960-1317/21/1/017002

3. He Y, Fu JZ, Chen ZC (2007) Research on optimization of the hot embossing process. J Micromech Microeng 17(12):2420. https://doi.org/10.1088/0960-1317/17/12/005

4. He Y, Fu JZ, Chen ZC (2008) Optimization of control parameters in micro hot embossing. Microsyst Technol 14(3):325–329. https://doi.org/10.1007/s00542-007-0497-8

5. He Y, Fu JZ, Zhao P et al (2013) Enhanced polymer filling and uniform shrinkage of polymer and mold in a hot embossing process. Polym Eng Sci 53(6):1314–1320. https://doi.org/10.1002/pen.23379

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