Author:
Lee Bong-Kee,Kwon Tai Hun
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Bacher W, Bade K, Matthis B, Saumer M, Schwarz R (1998) Fabrication of LIGA mold inserts. Microsyst Technol 4:117–119. doi: 10.1007/s005420050110
2. Di Bari GA (2000) Electrodeposition of nickel. In: Schlesinger M, Paunovic M (eds) Modern electroplating, 4th edn. Wiley, New York, pp 139–200
3. Ehrfeld W, Hessel V, Löwe H, Schulz C, Weber L (1999) Materials for LIGA technology. Microsyst Technol 5:105–112. doi: 10.1007/s005420050150
4. Fahrenberg J, Schaller T, Bacher W, El-Kholi A, Schomburg WK (1996) High aspect ratio multi-level mold inserts fabricated by mechanical micro machining and deep etch X-ray lithography. Microsyst Technol 2:174–177. doi: 10.1007/s005420050039
5. Heckele M, Bacher W, Műller KD (1998) Hot embossing—the molding technique for plastic microstructures. Microsyst Technol 4:122–124. doi: 10.1007/s005420050112
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