Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface-Reference-Cited by-同舟云学术

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Effects of bonding position on bending behavior of flexible anisotropic conductive film packages considering neutral surface

Published:2019-12-21 Issue:6 Volume:26 Page:1835-1845
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Lin Chao-Ming,Wu Chia-Chin

Funder

Ministry of Science and Technology, Taiwan

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-019-04729-0.pdf

Reference32 articles.

1. Askeland DR, Wright WJ (2019) Essentials of materials science and engineering, 4th edn, Cengage Learning

2. Babar AA, Bjorninen T, Bhagavati VA, Sydänheimo L, Kallio P, Ukkonen L (2012) Small and flexible metal mountable passive UHF RFID tag on high-dielectric polymer-ceramic composite substrate. IEEE Antennas Wirel Propag Lett 11:1319–1322

3. Chan YC, Luk DY (2002) Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. Microelectron Rel 42(8):1195–1204

4. Chen XC, Tao B, Yin ZP (2012) Bulk resistance evaluation of anisotropic conductive adhesive particles considering the current bending effect. ASME J Electron Packag 134(3):031007

5. Chin M, Iyer KA, Hu SJ (2004) Prediction of electrical contact resistance for anisotropic conductive adhesive assemblies. IEEE Trans Compon Packag Technol 27(2):317–326

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