The robustness of an algorithm applied in wafer-level material property extraction
Author:
Funder
National Science Council Taiwan
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://link.springer.com/content/pdf/10.1007/s00542-015-2581-9.pdf
Reference13 articles.
1. Chuang W-C, Hu Y-C, Chang P-Z (2012) CMOS-MEMS test-key for extracting wafer-level mechanical properties. Sensors 12:17094–17111
2. Dai C-L (2003) In situ electrostatic microactuators for measuring the Young’s modulus of CMOS thin films. J Micromech Microeng 13:563
3. Haluzan D, Klymyshyn D, Achenbach S, Börner M, Mohr J (2012) VM-TEST: mechanical property measurement using electrostatically actuated vertical MEMS test structures fabricated in thick metal layers. Microsyst Technol 18:443–452
4. Lee J-I (2012) Estimation of material properties in a MEMS based gyroscope using natural frequencies. Int J Precis Eng Manuf 13:1413–1417
5. Liu S, Wang QJ (2007) Determination of Young’s modulus and Poisson’s ratio for coatings. Surf Coat Technol 201:6470–6477
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