Author:
Guo Yuhua,Liu Gang,Zhu Xuelin,Tian Yangchao
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. Heckele M, Bacher W, Muller KD (1998) Hot embossing—the molding technique for plastic microstructures. Microsyst Technol 4:122–124
2. Pollock HM, Maugis D, Barquins M (1978) The force of adhesion between solid surfaces in contact. Appl Phys Lett 33:798
3. Tian Y, Zhang P, Liu G, Tian X (2005) The lifetime comparison of Ni and Ni-PTFE moulding inserts with high aspect-ratio structure. Microsyst Technol 11(4–5):261–264
4. Worgull M, Heckele M (2004) New aspects of simulation in hot embossing. Microsyst Technol 10:432–437
5. Zhang P, Liu G, Tian Y, Tian X (2005) The properties of demoulding of Ni and Ni-PTFE mouding insert. Sens Actuators A118:338–341
Cited by
56 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献