Funder
Natural Science and Engineering Research Council Canada (NSERC) of Canada’s discovery
Idea to Innovation (I2I) Phase I
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference35 articles.
1. Bagolini A, Savoia AS, Picciotto A, Boscardin M, Bellutti P, Lamberti N (2015) PECVD low stress silicon nitride analysis and optimization for the fabrication of CMUT devices. J Micromech Microeng 25(1):015012
2. Bakhtazad A, Manwar R, Chowdhury S (2015) Fabrication and characterization of sealed cavities realized by adhesive wafer bonding with dry etched Cyclotene™. Microsyst Technol 21(1):2435–2442
3. Cannata JM, Williams JA, Zhou Q, Ritter TA, Shung KK (2006) Development of a 35-MHz piezo-composite ultrasound array for medical imaging. IEEE Trans Ultrason Ferroelectr Freq Control 53(1):224–236
4. CYCLOTENE Advanced Electronics Resins—AP3000 Adhesion Promoter (2016a). The Dow Chemical Company [online]. http://www.dow.com/cyclotene/prod/ap3000.htm . Accessed on 14 Oct 2016
5. CYCLOTENE Advanced Electronics Resins—Electrical Properties (2016b). The Dow Chemical Company [online]. http://www.dow.com/cyclotene/solution/elecprop.htm . Accessed 18 Apr 2016
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