Grain Boundary Migration with Thermal Grooving Effects: A Numerical Approach
Author:
Publisher
Springer Science and Business Media LLC
Subject
Applied Mathematics,Numerical Analysis,Analysis
Link
http://link.springer.com/article/10.1007/BF03377411/fulltext.html
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3. A. Averbuch, M. Israeli, and I. Ravve. Electromigration of intergranular voids in metal films for microelectronic interconnects. J. Comp. Phys., 186:481–502, 2003.
4. K. Barmak, E. Eggeling, D. Kinderlehrer, R. Sharp, S. Ta’asan, A.D. Rollett, and K.R. Coffey. Grain growth and the puzzle of its stagnation in thin films: the curious tale of a tail and an ear. Prog. Mat. Sci., 58:987–1055, 2013.
5. K. Barmak, M. Emelianenko, D. Golovaty, D. Kinderlehrer, and S. Ta’asan. Towards a statistical theory of texture evolution in polycrystals. SIAM J. Sci. Comput., 30:3150–3169, 2008.
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