Three-dimensional fracture analysis of thin-film debonding-Reference-Cited by-同舟云学术

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Three-dimensional fracture analysis of thin-film debonding

Published:1990-12 Issue:4 Volume:46 Page:237-256
ISSN:0376-9429
Container-title:International Journal of Fracture
language:en
Short-container-title:Int J Fract

Author:

Chai Herzl

Publisher

Springer Science and Business Media LLC

Subject

Mechanics of Materials,Modeling and Simulation,Computational Mechanics

Link

http://link.springer.com/content/pdf/10.1007/BF00037155.pdf

Reference27 articles.

1. H. Dannenberg, Journal of Applied Polymer Science 5 (1961) 125?34.

2. G.P. Anderson, S.J. Bennett and K.L. DeVries, Analysis and Testing of Adhesive Bonds, Academic Press (1977).

3. K.M. Liechti and E.C. Hanson, International Journal of Fracture 36 (1988) 199?217.

4. G. Gille, in Current Topics in Materials Science 12, North-Holland, E. Kaldis (ed.) (1985) 421?49.

5. L.M. Kachanov, Mekhanika Polimerov 6 (1975) 1106?08.

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