Influence of process parameters on the bonding performance of wood adhesive based on thermally modified soy proteins

Author:

Vnučec Doroteja,Mikuljan Marica,Kutnar Andreja,Šernek Milan,Goršek Andreja

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science,Forestry

Reference31 articles.

1. Amaral-Labat GA, Pizzi A, Gonҫalves AR, Celzard A, Rigolet S, Rocha GJM (2008) Environment-friendly soy flour-based resins without formaldehyde. J Appl Polym Sci 108:624–632

2. Ciannamea EM, Martucci JF, Stefani PM, Ruseckaite RA (2012) Bonding quality of chemically modified soybean protein concentrate-based adhesives in particleboards from rice husks. J Am Oil Chem Soc 89:1733–1741

3. European standard EN 204:2002. Classification of thermoplastic wood adhesives for non-structural applications. European Committee for Standardization

4. European standard EN 205:2003. Adhesives—wood adhesives for non-structural applications—determination of tensile shear strength of lap joints. European Committee for Standardization

5. Frihart CR (2013) Wood adhesion and adhesives. In: Rowell RM (ed) Handbook of wood chemistry and wood composites, 2nd edn. CRC Press, Florida, pp 215–278

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