Procedural influence on the properties of particleboards made from AKD modified chips-Reference-Cited by-同舟云学术

Procedural influence on the properties of particleboards made from AKD modified chips

Published:2009-02-19 Issue:3 Volume:67 Page:303-311
ISSN:0018-3768
Container-title:European Journal of Wood and Wood Products
language:en
Short-container-title:Eur. J. Wood Prod.

Author:

Hundhausen Ulrich,Stohldreier Roman,Militz Holger,Mai Carsten

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science,Forestry

Link

http://www.springerlink.com/index/pdf/10.1007/s00107-009-0309-1

Reference51 articles.

1. Amthor J (1972) Paraffindispersionen zur Hydrophobierung von Spanplatten – Paraffin dispersions for the waterproofing of particle board. Holz- Roh Werkst 30(11):422–429

2. Baumann W, Herberg-Liedtke B (1994) Papierchemikalien: Daten und Fakten zum Umweltschutz. Springer, Berlin Heidelberg New York

3. Boonstra MJ, Pizzi A, Ohlmeyer M, Paul W (2006) The effects of a two stage heat treatment process on the properties of particleboard. Holz- Roh Werkst 64(2):157–164

4. Burmester A, Deppe H-J (1973) Versuche zur Dimensionsstabilisierung von Spanplatten durch Spänebehandlung nach dem FWD-Verfahren. Holzbearbeitung 20(7):24, 26, 28, 30

5. Christiansen AW (1990) How overdrying wood reduces its bonding to phenol-formaldehyde adhesives: A critical review of the literature. Part I. Physical responses. Wood Fiber Sci 22(4):441–459

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of paraffin application technique on the physical and mechanical properties of particleboard;Science and Engineering of Composite Materials;2014-03-01

2. PF-bonded particleboards from AKD-modified chips;European Journal of Wood and Wood Products;2009-07-31