Fatigue Growth Analysis of Pre Induced Surface Defects Using Piezoelectric Wafer Based Impedance Method and Digital Image Correlation System

Author:

Annamdas Venu Gopal Madhav,Chew Youxiang,Pang John Hock Lye,Hoh Hsin Jen,Zhou Kun,Song Bin

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials

Reference58 articles.

1. Sevostianov, I., Zagrai, A., Kruse, W.A., Hardee, H.: Connection between strength reduction, electric resistance and electro-mechanical impedance in materials with fatigue damage. Int. J. Fract. 164, 159–166 (2010)

2. Chermahini, R.G., Palmberg, B., Blom, A.F.: Fatigue crack growth and closure behaviour of semicircular and semi-elliptical surface flaws. Int. J. Fatigue 15(4), 259–263 (1993)

3. Taylor, S.G., Park, G., Farinholt, K.M., Todd, M.D.: Diagnostics for piezoelectric transducers under cyclic loads deployed for structural health monitoring applications. Smart Mater. Struct. 22(2), 025024 (2013). doi: 10.1088/0964-1726/22/2/025024

4. Thomas, D., Welter, J., Giurgiutiu, V.: Corrosion damage detection with piezoelectric wafer active sensors, SPIE’s 11th Annual International Symposium on Smart Structures and Materials and 9th Annual International Symposium on NDE for Health Monitoring and Diagnostics, San Diego, CA, 14–18 March 2004, paper # 5394–2

5. Liu, Y., Mohanty, S., Chattopadhyay, A.: Prediction of Fatigue Damage and Residual Useful Life for Composite Structures Using Passive Sensing, International Workshop on Structural Health Monitoring (IWSHM) Conference. Stanford University, Stanford (2009)

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