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Analysis of vapor deposition processes

Published:1974-01 Issue:1 Volume:5 Page:
ISSN:0026-086X
Container-title:Metallurgical Transactions
language:en
Short-container-title:Metall Mater Trans B

Author:

Szekely J.,Poveromo J. J.

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/BF02642953.pdf

Reference18 articles.

1. O. Winkler and R. Bakish:Vacuum Metallurgy, pp. 212–21, Elsevier, New York, 1971.

2. R. F. Bunshah:Trans. Vacuum. Met. Conf., New York, 1963, p. 121, American Vacuum Society, Mass. 1964.

3. L. Muller:Freiberger Forsch., B33, 1958, quoted by R. F. Bunshah, (in Ref. 2).

4. T. R. A. Davey: Vacuum, 1962, vol. 12, p. 83.

5. B. Ilschener and J. Humbert:Z. Metallic., 1960, vol. 51, pp. 626–31.

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1. Evaporation;Handbook of Deposition Technologies for Films and Coatings;2010

2. Vacuum Micro-Electroforming Technique for the Production of Void-Free Microcomponent;Key Engineering Materials;2010-01

3. Thermal Evaporation Sources;Principles of Vapor Deposition of Thin Films;2006

4. Activities of As, Sb, Bi, and Pb in copper mattes—impurity elimination;Metallurgical Transactions B;1987-03

5. Rates of evaporation of silver, lead, and bismuth from copper alloys in vacuum induction melting;Metallurgical Transactions B;1976-12

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