Structural parameters of Cu films-Reference-Cited by-同舟云学术

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Structural parameters of Cu films

Published:1975-03 Issue:1 Volume:26 Page:148-156
ISSN:1826-9877
Container-title:Il Nuovo Cimento B Series 11
language:en
Short-container-title:Nuov Cim B

Author:

Mannan Kh. M.,Chakravarty B.

Publisher

Springer Science and Business Media LLC

Subject

General Medicine

Link

http://link.springer.com/content/pdf/10.1007/BF02755543.pdf

Reference18 articles.

1. K. R. Dixit:Phil. Mag.,16, 1049 (1933).

2. D. Walton:Phil. Mag.,7, 1671 (1962).

3. H. Reiss:Journ. Appl. Phys.,39, 5045 (1968).

4. R. L. Sehalla, N. W. Triondswell andF. D. Coffin:Single Crystal Films, edited byM. R. Franscombe andP. Sata (London, 1964), p. 301.

5. C. Sella andJ. J. Trillat:Single Crystal Films, edited byM. R. Franscombe andP. Sata (London, 1964), p. 201.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Temperature coefficient of resistivity for polycrystalline Cu-films;Physics Letters A;1977-10

2. Grain boundary contribution to the electrical conductivity of polycrystalline Cu films;Journal of Physics F: Metal Physics;1975-09

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