Solid–Liquid Composites with High Impact Resistance

Author:

Yu Miao,Li Xiying,Lv Pengyu,Duan Huiling

Abstract

AbstractSolid–liquid composites (SLCs) with novel thermal/electronic/mechanical properties imparted by programmable and functional liquid inclusions have attracted considerable research interest in recent years, and are widely used in smart electronics and soft robotics. The feasible application of SLCs requires that they exhibit excellent static physical properties as well as dynamic impact resistance to satisfy complex service conditions, such as drops and impacts. This paper examined the impact resistance of SLCs fabricated by using microfluidic 3D printing. The results of dynamic split-Hopkinson pressure bar (SHPB) tests showed that the performance of the fabricated SLCs improved in terms of energy dissipation and impact resistance compared with pristine materials. In case of dynamic impact in the strain rates ranging from 100 to $$400\,\hbox {s}^{-1}$$ 400 s - 1 , the SLC specimen deformed without fracture, and its energy dissipation was dominated by the viscosity of the liquid inclusions. For dynamic impact in the strain rates ranging from 500 to $$800\,\hbox {s}^{-1}$$ 800 s - 1 , the SLC specimen fractured and its energy dissipation was determined by the volume fraction of the liquid inclusions. Thus, the energy dissipation of the SLCs could be tuned by regulating the viscosity and volume fraction of the liquid inclusions to satisfy the requirements of protection against different strain rates. Furthermore, the process of fracture of the SLCs under the dynamic SHPB tests was recorded and analyzed by using a high-speed camera. The results showed that distributed liquid inclusions changed the paths of crack propagation to enhance energy dissipation in the SLCs. This study experimentally verified the enhancement in the energy dissipation of SLCs, and provided design strategies for developing multifunctional SLCs with high impact resistance.

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Computational Mechanics

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