The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder-Reference-Cited by-同舟云学术

The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin-bismuth solder

Published:1987-05 Issue:5 Volume:22 Page:1835-1839
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Tomlinson W. J.,Collier I.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF01132413.pdf

Reference10 articles.

1. V. R. Allies, Proceedings National Electronic Packaging Conference, Anaheim, California, 1981 (Kiver Communications, Surbiton, Surrey, 1981) p. 575.

2. P. W. Schuessler,ibid. (Kiver Communications, Surbiton, Surrey, 1980) p. 45.

3. R. J. Klein Wassink, ?Soldering in Electronics? (Electrochemical Publications, Ayr, 1984) p.83.

4. C. A. Mackay andW. D. Von Voss,Mater. Sci. Technol. 1 (1985) 240.

5. W. J. Tomlinson andN. J. Bryan,J. Mater, Sci. 21 (1986) 103.

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