High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication-Reference-Cited by-同舟云学术

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High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication

Published:2014-06-04 Issue:7 Volume:7 Page:998-1006
ISSN:1998-0124
Container-title:Nano Research
language:en
Short-container-title:Nano Res.

Author:

Triplett Mark,Nishimura Hideki,Ombaba Matthew,Logeeswarren V. J.,Yee Matthew,Polat Kazim G.,Oh Jin Y.,Fuyuki Takashi,Léonard François,Islam M. Saif

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,General Materials Science,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Link

http://link.springer.com/content/pdf/10.1007/s12274-014-0462-7.pdf

Reference31 articles.

1. McAlpine, M. C.; Ahmad, H.; Wang, D. W.; Heath, J. R. Highly ordered nanowire arrays on plastic substrates for ultrasensitive flexible chemical sensors. Nat. Mater. 2007, 6, 379–384.

2. Fan, Z. Y.; Ho, J. C.; Takahashi, T.; Yerushalmi, R.; Takei, K.; Ford, A. C.; Chueh, Y. L.; Javey, A. Toward the development of printable nanowire electronics and sensors. Adv. Mater. 2009, 21, 3730–3743.

3. Reuss, R. H.; Chalamala, B. R.; Moussessian, A.; Kane, M. G.; Kumar, A.; Zhang, D. C.; Rogers, J. A.; Hatalis, M.; Temple, D.; Moddel, G.; et al. Macroelectronics: Perspectives on technology and applications. Proc. IEEE. 2005, 93, 1239–1256.

4. Hoffmann, S.; Utke, I.; Moser, B.; Michler, J.; Christiansen, S. H.; Schmidt, V.; Senz, S.; Werner, P.; Gosele, U.; Ballif, C. Measurement of the bending strength of vapor-liquid-solid grown silicon nanowires. Nano. Lett. 2006, 6, 622–625.

5. Maiolo, J. R.; Kayes, B. M.; Filler, M. A.; Putnam, M. C.; Kelzenberg, M. D.; Atwater, H. A.; Lewis, N. S. High aspect ratio silicon wire array photoelectrochemical cells. J. Am. Chem. Soc. 2007, 129, 12346–12347.

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