Dynamic Analysis of an Infinite Cylindrical Hole in a Saturated Poroelastic Medium
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering
Link
http://link.springer.com/content/pdf/10.1007/s00419-006-0025-9.pdf
Reference32 articles.
1. Tranter C.J. (1946). On the elastic distortion of a cylindrical hole by a localized hydrostatic pressure. Q Appl Math 4:298–302
2. Bowie O.L. (1947). Elastic stresses due to a semi-infinite band of hydrostatic pressure acting over a cylindrical hole in an infinite solid. Q Appl Math 5:100–101
3. Parnes R. (1983). Applied tractions on the surface of an infinite cylindrical bore. Int J Solids Structures 19:165–177
4. Selberg W.L. (1952). Transient compression waves from spherical and cylindrical cavities. Ark Fys 5:97–108
5. Jordan D.W. (1962). The stress wave from a finite cylindrical explosive source. J Math Mech 11:503–551
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A half-space singular boundary method for predicting ground-borne vibrations;Applied Mathematical Modelling;2022-11
2. Axisymmetric transient response of a cylindrical cavity in an unsaturated poroelastic medium;Journal of Sound and Vibration;2022-04
3. Vibration Characteristics of Subway Tunnel Structure in Viscous Soil Medium;Advances in Materials Science and Engineering;2021-02-08
4. Dynamic effect of a moving ring load on a cylindrical structure embedded in poroelastic space based on nonlocal Biot theory;Soil Dynamics and Earthquake Engineering;2020-01
5. Analytical wave function method for modelling a twin tunnel embedded in a saturated poroelastic full-space;Computers and Geotechnics;2019-10
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3