Aluminum Metallization Technology for Semiconductor Devices-Reference-Cited by-同舟云学术

Aluminum Metallization Technology for Semiconductor Devices

Published:1985-05 Issue:5 Volume:37 Page:55-59
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Garosshen T. J.,Stephenson T. A.,Slavin T. P.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF03257742.pdf

Reference29 articles.

1. C. L. Seitz and J. Matiso, “Engineering Limits on Computer Performance,” Physics Today, May 1984, p. 38.

2. A. Reisman, “The Technology and Engineering Challenges Posed by Very Large Scale Integration,” Proceedings of the Electrochemical Societies Tutorial Symposium on Semiconductor Technology, Vol. 82–5, 1982, p. 22.

3. D. Pramanik and A. N. Savena, “VLSI Metallization Using Aluminum and Its Alloys,” Solid State Technology, January 1983, p. 127.

4. R. A. Cololaser, Microelectronics: Processing and Device Design, John Wiley and Sons, New York, New York, 1980.

5. D. J. Elliott, Integrated Circuit Fabrication Technology, McGraw-Hill Book Co., New York, New York 1982.

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