Funder
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Industrial and Manufacturing Engineering,Mechanics of Materials
Reference44 articles.
1. D. M. Jacobson, A. Ogilvy and A. Leatham, A new light-weight electronic packaging technology based on spray-formed silicon-aluminium, Proceedings of the International Symposium on Advanced Packaging Materials: Processes, Properties Andinterfaces IEEE 295-299 (2000).
2. C. Zweben, Advanced composites and other advanced materials for electronic packaging thermal management, Proceedings of the International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces IEEE 360-365 (2001).
3. E.B. Moustafa, M.A. Taha, Evaluation of the microstructure, thermal and mechanical properties of Cu/SiC nanocomposites fabricated by mechanical alloying. Int. J. Miner. Metall. Matter. 28, 475–486 (2021). https://doi.org/10.1007/s12613-020-2176-z
4. N. Jiang, J. P. Novak and R. L. Fink, Fabrication and characterization of carbon-aluminum thermal management composites, Proceedings of the 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) 87-92 (2010). https://doi.org/10.1109/stherm.2010.5444308
5. N.K. Sharma, R.K. Misra, S. Sharma, Modeling of thermal expansion behavior of densely packed Al/SiC composites. Int. J. Solid Struct. 102, 77–88 (2016). https://doi.org/10.1016/j.ijsolstr.2016.10.015
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