Author:
Kota Pavan Kalyan,Amogh T. K.,Vignesh R. Vaira,Govindaraju M.
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Industrial and Manufacturing Engineering,Mechanics of Materials
Cited by
1 articles.
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1. Investigations on the diffusion bonding of titanium alloy and aluminum alloy using copper at low bonding pressure;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2023-09-10