TsanKit: artificial intelligence for solder ball head-in-pillow defect inspection

Author:

Tsan Ting-Chen,Shih Teng-FuORCID,Fuh Chiou-Shann

Publisher

Springer Science and Business Media LLC

Subject

Computer Science Applications,Computer Vision and Pattern Recognition,Hardware and Architecture,Software

Reference23 articles.

1. Wikipedia, Inspection in manufacturing. https://en.wikipedia.org/wiki/Inspection_in_manufacturing, (2019).

2. Encyclopedia, BGA Definition from PC Magazine Encyclopedia, https://www.pcmag.com/encyclopedia/term/38577/bga, 2019.

3. D. Xie, et al. Head in Pillow (HIP) and yield study on SIP and PoP assembly. In: Proceedings of IEEE Electronic Components and Technology Conference, San Diego, California, pp. 752–758, (2009).

4. Gondrom, S., et al.: X-Ray computed laminography: an approach of computed tomography for applications with limited access. Nucl. Eng. Des. 190(1–2), 141–147 (1999)

5. Agilent Technologies, Chemical analysis, life sciences, and diagnostics-agilent, https://www.agilent.com, 2019.

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