Adhesive developments in forest products

Author:

Chow S.

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Plant Science,General Materials Science,Forestry

Reference35 articles.

1. Abe, I. 1970: Study of lignin formalydehyde resin. Hokkaido Forest Products Research Institute Report H55, March: 131 p

2. Chow, S., Steiner, P. R. 1979: Comparisons of the cure of phenol-formaldehyde novalac and resol systems by differential scanning calorimetry. J. Appl. Polym. Sci. 23: 1973?1985

3. Chow, S.; Rozon, L.; Steiner, P. R. 1979. Efficiency of coniferous foliage as extender for powdered phenolic resin. Proc. Thirteenth Particleboard Symp., Wash. State Univ. Pullman, Wa. 329?342

4. Chow, S.; Caster, R. W. 1978: Relationship of adhesive softening temperature to exposure tests for bond durability. Forest Prod. J. 28(6): 38?43

5. Chow, S. 1977: A curing study of phenol-resorcinol-formaldehyde resins using infrared spectrophotometer and thermal analysis. Holzforschung 31(6): 200?205

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