Crosstalk noise analysis of coupled on-chip interconnects using a multiresolution time domain (MRTD) technique
Author:
Funder
University Grants Commission
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Modeling and Simulation,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Link
https://link.springer.com/content/pdf/10.1007/s10825-021-01828-y.pdf
Reference31 articles.
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2. Khezeli, M.R., Moaiyeri, M.H., Jalali, A.: Active shielding of MWCNT bundle interconnects: an efficient approach to cancellation of crosstalk-induced functional failures in ternary logic. IEEE Trans. Electromag. Compat. 61(1), 100–110 (2018). https://doi.org/10.1109/temc.2017.2788500
3. Rabaey, J.M., Chandrakasan, A.P., Nikolić, B.: Digital integrated circuits: a design perspective, vol. 7. Pearson education, Upper Saddle River, NJ (2003)
4. Alpert, C.J., Devgan, A., Kashyap, C.V.: RC delay metrics for performance optimization. IEEE Trans. Comput. Aid. Des. Integr. Circuits. Syst. 20(5), 571–582 (2001). https://doi.org/10.1109/43.920682
5. Rubinstein, Jorge, Penfield, Paul, Horowitz, Mark A.: Signal delay in RC tree networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 2(3), 202–211 (1983). https://doi.org/10.1145/62882.62932
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