Prediction enhancement of the J-lead interconnection reliability of land grid array sockets
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://link.springer.com/content/pdf/10.1007/s12206-015-0439-9.pdf
Reference19 articles.
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3. L. Sangil, Z. H. Min and F. B. Daniel, A numerical study of void nucleation and growth in a flip chip assembly process, Modelling and Simulation in Materials Science and Engineering, 18 (6) (2010) 065005.
4. T.-W. Hui and G.-H. Pang, Solder paste inspection using region-based defect detection, International Journal of Advanced Manufacturing Technology, 42 (7–8) (2009) 725–734.
5. A. Saenthon and S. Kaitwanidvilai, Development of new edge-detection filter based on genetic algorithm: An application to a soldering joint inspection, International Journal of Advanced Manufacturing Technology, 46 (9–12) (2010) 1009–1019.
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2. A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding;Scientific Reports;2019-01-31
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