High-temperature dynamic deformation of aluminum alloys using SHPB

Author:

Lee Ouk Sub,Choi HyeBin,Kim HongMin

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials

Reference11 articles.

1. H. Kolsky, Stress Wave in Solids, Dover Publications, Inc, New York, USA (1963).

2. O. S. Lee, G. H. Kim, M. S. Kim and S. W. Hwang, Dynamic deformation behavior of aluminum alloys under high strain rate compressive/tensile loading, Proc. of the KSME 2000 Fall Annual Meeting (2000) 268–273.

3. D. Gerlich, and E. S. Fisher, The high temperature elastic moduli of aluminum, J. Phys.Chem.Solid, 30 (1969)1197–1205.

4. Y. Y. Cho and H. S. Kim, State dependence of activation energies for high temperature creep of Al7075 alloy, KSME journal, 17 (1993)131–140.

5. O. S. Lee, S. W. Hwang, H. B. Choi, D. H. Kim and H. M. Kim, Dynamic deformation of aluminum alloys ay high temperature by using SHPB techniques, Proc. of 9th International Conference on the Mechanical Physical Behavior of Materials under Dynamic Loading (2009) 443–448.

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3