Sound visualization of smartphone-radiated noise using nearfield acoustic holography-Reference-Cited by-同舟云学术

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Sound visualization of smartphone-radiated noise using nearfield acoustic holography

Published:2022-07-29 Issue:8 Volume:36 Page:3875-3882
ISSN:1738-494X
Container-title:Journal of Mechanical Science and Technology
language:en
Short-container-title:J Mech Sci Technol

Author:

Park Taeyoung,Im Seonghun,Kim Donghyun,Woo Sangbeom,Jang Inman,Ohm Won-Suk,Park Heungkil,Park Sehun,Ji Guwon

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials

Link

https://link.springer.com/content/pdf/10.1007/s12206-022-0710-9.pdf

Reference18 articles.

1. Y. Sun, J. Zhang, Z. Yang, C. Hwang and S. Wu, Measurement investigation on acoustic noise caused by “singing” capacitors on mobile devices, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity (EMC+SIPI) (2019) 505–510.

2. H. Baek, D. Yu, J. Lee, H. Shim and J.-H. Kim, Electrical approach to acoustic noise for MLCCs of power delivery network in mobile system, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (2015) 62–66.

3. J. D. Prymak, Piezoelectric effects ceramic chip capacitors (singing capacitors), Arrow Asian Times Article, KEMET Electronics Corporation (2006).

4. S. P. Lee and K. W. Kang, Analysis for deformation behavior of multilayer ceramic capacitor based on multiscale homogenization approach, Journal of Mechanical Science and Technology, 32 (6) (2018) 2577–2585.

5. B.-H. Ko, S.-G. Jeong, Y.-G. Ahn, K.-S. Park, N.-C. Park and Y.-P. Park, Analysis of the correlation between acoustic noise and vibration generated by a multi-layer ceramic capacitor, Microsystem Technologies, 20 (2014) 1671–1677.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Acoustic-noise reduction in printed circuit boards based on location and direction of multilayer ceramic capacitors;Journal of Mechanical Science and Technology;2024-08

2. Analysis Method of Multilayer Ceramic Capacitor Fracture by the Phase-Field;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-02

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