Author:
Kim Hyun Jung,An Byoung Hoon,Park Jinil,Kim Dong-Kwon
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Reference18 articles.
1. S. Oktay, R. J. Hannemann and A. Bar-Cohen, High heat from a small package, Mechanical Engineering 108 (1986) 36–42.
2. A. Bar-Cohen, Thermal management of electric components with dielectric liquids, Proceedings of ASME/JSME Thermal Engineering Joint Conference 2 (1996) 15–39.
3. J. Park, M. Shin and C. C. Lee, Measurement of temperature profiles on visible light-emitting diodes by use of a nematic liquid crystal and an infrared laser, Optics letters 29 (2004) 2656–2658.
4. F. P. Incropera, Convection heat transfer in electronic equipment cooling, Journal of Heat Transfer 110 (1988) 1097–1111.
5. W. Nakayama, Thermal management of electronic equipment: A review of technology and research topics, Applied Mechanics Reviews 39 (1986) 1847–1868.
Cited by
34 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献