Effect of heat source area on the thermal resistance of the wick columns vapor chambers
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://link.springer.com/content/pdf/10.1007/s12206-016-0147-0.pdf
Reference36 articles.
1. K. I. Han, S. S. Yee, S. H. Park, S. H. Lee and D. H. Cho, A Study on the improvement of heat transfer performance in low temperature closed thermosyphon, KSME International Journal, 16 (2002) 1102–1111.
2. K. I. Han, D. H. Cho and J. U. Park, Investigation of boiling heat transfer characteristics of two-phase closed thermosyphons with various internal grooves, KSME lnternational Journal, 17 (2003) 1739–1745.
3. K. Han and D. H. Cho, Theoretical and experimental studies boiling heat transfer for the thermosyphons with various helical grooves, Journal of Mechanical Science and Technology (KSME Int. J.), 19 (2005) 1662–1669.
4. K. Lim and H. Roh, Thermal characteristics of graphite foam thermosyphon for electronics cooling, Journal of Mechanical Science and Technology, 19 (2005) 1932–1938.
5. Y. Koito, H. Imura, M. Mochizuki, Y. Saito and S. Torii, Numerical analysis and experimental verification on ther mal fluid phenomena in a vapor chamber, Applied Thermal Engineering, 26 (2006) 1669–1676.
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Sensitivity and optimization analysis of pillar arrangement on the thermal–hydraulic performance of vapor chamber;Applied Thermal Engineering;2024-03
2. Cooling of power electronic devices using rectangular flat heat pipes with externally and internally cooled condenser regions;Applied Thermal Engineering;2024-01
3. Comparative analysis of integrated heat sink vapor chamber with conventional heat sink for LED cooling;Materials Today: Proceedings;2023
4. Cooling of high heat flux miniaturized electronic devices using thermal ground plane: An overview;Renewable and Sustainable Energy Reviews;2022-12
5. A review of the thermal performance of vapor chambers and heat sinks: Critical heat flux, thermal resistances, and surface temperatures;International Journal of Heat and Mass Transfer;2022-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3