Author:
Park Joonsub,Lee Jeonghoon
Publisher
Springer Science and Business Media LLC
Reference15 articles.
1. T. S. Jeong, J. M. Kim, C. W. Lee and Y. B. Park, Effect of PCB surface finishs on intermetallic compound growth kinetics of Sn-3.0 Ag-0.5 Cu solder bump, Journal of the Microelectronics and Packaging Society, 17(1) (2010) 81–88.
2. S. M. Hyun and C. W. Lee, TSV core technology for 3D IC packaging, Journal of Welding and Joining, 27(3) (2009) 4–9.
3. H. Emi, N. Namiki and Y. Otani, Removal of fine particles from smooth flat surfaces by consecutive pulse air jets, Aerosol Science and Technology, 23(4) (1995) 665–673.
4. J. S. Park and J. Lee, A study on the effect of air jet on particle cleaning at wafer surface, Transactions of the Korean Society of Mechanical Engineers B, 44(9) (2020) 583–590.
5. K. C. Noh, H. C. Lee, D. Y. Kim and M. E. Oh, Method of particle contamination control for yield enhancement in the clean-room, Transactions of the Korean Society of Mechanical Engineers B, 31(6) (2007) 522–530.