Factors affecting the structure of copper deposits electrowon from aqueous chloride electrolyte-Reference-Cited by-同舟云学术

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Factors affecting the structure of copper deposits electrowon from aqueous chloride electrolyte

Published:1985-09 Issue:5 Volume:15 Page:649-658
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Mackinnon D. J.,Brannen J. M.,McMillan R. S.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF00620560.pdf

Reference10 articles.

1. S. D. Gokhale,J. Sci. Ind. Rev. 10B (1951) 316.

2. F. P. Haver and M. M. Wong, US Bur. Mines, R.I.8007 (1975) 16.

3. S. H. Langer, T. D. Kaun and M. A. Nametz,J. Met., July (1976) 9.

4. R. E. Mussler, R. S. Olsen and T. T. Campbell, US Bur. Mines, R.I. 8076 (1975) 21.

5. M. E. Cook and G. E. Atwood, US Patent 4 025 400 (1977).

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Diffusion Coefficients of Cuprous and Cupric Ions in Electrolytes with High Concentrations of Bromide Ions;Journal of Chemical & Engineering Data;2019-02-27

2. Electrodeposition of copper from pure cupric chloride hydrochloric acid solutions;Journal of Applied Electrochemistry;1997

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